3D Semiconductor Packaging Market is expected to garner $8.9 Billion by 2022, growing at a CAGR of 15.7%. In the year 2015, Asia-Pacific dominated the global market and contributed over 50% of the overall market and it’s anticipated to continue this trend during the forecast period.
3D semiconductor packaging is an advanced packaging technology to fabricate high performance chips such as flash memories, DRAMS, NAND, and others, which are highly used in high-performance computers, image sensors, smartphones, and others. The demand for 3D semiconductor packaging market is globally expected to rise during the forecast period due to increase in demand for miniaturized circuits and short replacement period of electronics products, which are primarily constituted of integrated circuits manufactured with 3D packaging technology.
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Electronics industry contributed over 48% of the overall 3D semiconductor packaging market in 2015. Increase in penetration of 3D semiconductor packaged chips in devices such as smartphones, laptops, digital cameras, and others drives the growth in market as these chips are majorly used in camera and memory. However, IT & telecom is expected to grow fastest at a CAGR of 19.2% during the forecast period, owing to increased investment by developing nations to increase connectivity and rise in number of wireless devices worldwide.
Asia-Pacific dominated the market in 2015, accounting over 50% of the total market revenue, and is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities, ongoing R&D, high consumption, and production of electronic products where 3D semiconductor packaged chips are steadily utilized. Further, North America and Europe are the second and third leading regions in 3D semiconductor packaging market, and are expected to witness fast paced growth as the market is still in its developing phase.
Increase in trend of miniaturization in portable electronic industry and rise in dependency on these devices worldwide is shifting device manufacturers toward finding new methods of size reduction and overall efficiency enhancement of these devices, thus driving the growth of 3D semiconductor packaging market states Gaurav Shukla, Research Associate, Semiconductor and Electronics at AMR.
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Key findings of the study:
- 3D wire bonded dominated the market in 2015 with over 43% of market share, however, 3D TSV is expected to witness the highest growth rate of 17%
- In 2015, Bonding wire accounted for the second largest share in 3D semiconductor packaging technology segment although it will slowly be replaced by TSV technology in long run
- In North America, United States accounts for over 70% of the overall market owing to high penetration of 3D TSV technology.
The key players of the global 3D semiconductor packaging market are employing novel concepts & ideas, improving manufacturing techniques, and improving the current set of products, besides enhancing their profitability to gain a competitive edge over the other market players.
The key players profiled in the report include Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, and Taiwan Semiconductor Manufacturing Company.
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