MarketResearchNest Reports adds “Global Underfill Market Growth 2019-2024”new report to its research database. The report spread across 165 pages with multiple tables and figures in it.
This comprehensive Underfill Market research report includes a brief on these trends that can help the businesses operating in the industry to understand the market and strategize for their business expansion accordingly. The research report analyzes the market size, industry share, growth, key segments, CAGR and key drivers.
This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn’t change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.
In China, the high-end underfill products mainly rely on import from foreign developed countries, like US, Germany, Japan. To meet the large demand for the high-end products, Chinese manufacturers will invest much more on the RandD, which will certainly weaken the dependence of imports.
According to this study, over the next five years the Underfill market will register a 3.4% CAGR in terms of revenue, the global market size will reach US$ 470 million by 2024, from US$ 380 million in 2019.
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This report also splits the market by region:
Americas, United States, Canada, Mexico, Brazil, APAC, China, Japan, Korea, Southeast Asia, India, Australia, Europe, Germany, France, UK, Italy, Russia, Spain, Middle East and Africa, Egypt, South Africa, Israel, Turkey, GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond
Segmentation by product type:
Semiconductor Underfills
Board Level Underfills
Segmentation by application:
Industrial Electronics
Defense and Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
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Research objectives
- To study and analyze the global Underfill consumption (value and volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
- To understand the structure of Underfill market by identifying its various subsegments.
- Focuses on the key global Underfill manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
- To analyze the Underfill with respect to individual growth trends, future prospects, and their contribution to the total market.
- To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
- To project the consumption of Underfill submarkets, with respect to key regions (along with their respective key countries).
- To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
- To strategically profile the key players and comprehensively analyze their growth strategies.
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